• DEBORN

Ihe mgbochi ire ọkụ na-anaghị emeghachi omume na DOPO

Ihe ndị na-egbochi ire ọkụ na-abụghị halogen maka resins Epoxy, nke enwere ike iji na PCB na semiconductor encapsulation, ihe na-egbochi odo odo nke usoro ihe mejupụtara maka ABS, PS, PP, resin Epoxy na ndị ọzọ. Ihe ndị na-egbochi ire ọkụ na kemịkalụ ndị ọzọ.


  • Aha ngwaahịa:9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
  • Usoro Molekụla:C12H9O2P
  • Ibu molekụla:216.16
  • Nọmba CAS:35948-25-5
  • Nkọwa Ngwaahịa

    Akara Ngwaahịa

    Nchọpụta Ngwaahịa
    Aha ngwaahịa: 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
    Nchikota: DOPO
    Nọmba CAS: 35948-25-5
    Ibu molekụla: 216.16
    Usoro molekụla: C12H9O2P
    Usoro nhazi

    DOPO

    Akụ na ụba

    Oke 1.402 (30℃)
    Ebe agbaze 116℃-120℃
    Ebe isi mmiri 200℃ (1mmHg)

    Ndepụta teknụzụ

    Ọdịdị ntụ ntụ ọcha ma ọ bụ flake ọcha
    Nnyocha (HPLC) ≥99.0%
    P ≥14.0%
    Cl ≤50ppm
    Fe ≤20ppm

    Ngwa
    Ihe ndị na-egbochi ire ọkụ na-abụghị halogen maka resins Epoxy, nke enwere ike iji na PCB na semiconductor encapsulation, ihe na-egbochi odo odo nke usoro ihe mejupụtara maka ABS, PS, PP, resin Epoxy na ndị ọzọ. Ihe ndị na-egbochi ire ọkụ na kemịkalụ ndị ọzọ.

    Ngwugwu
    25 Kg/akpa.

    Nchekwa
    Debe n'ebe dị jụụ, kpọrọ nkụ, nke ikuku na-abata nke ọma, ebe ihe na-eme ka oxidation sie ike na-adịghị.


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